来源：GIST
　
The MSc Microelectronics is a highly specialized programme offered on a full-time basis for training engineers to work in silicon wafer fabrication industries, engage with the related research institutions and pursue further studies.

Students are required to take 12 modules in microelectronics topics, including 6 core modules, 4 elective modules, and 2 laboratory modules, and to complete a one-semester project. Each technical module has 45 contact hours. The project should be on a topic related to microelectronics, may be undertaken either at NTU or at TUM or in the industry. In addition, students will take an English module of 80 hours and 5 other non-technical short modules of 10 hours each. The technical modules are as follows:
Core Modules

Advanced Wafer Processing
Quality and Reliability Engineering
Advanced Topics in Semiconductor Devices
Nanoelectronics
Advanced MOSEFTs & Novel Devices
Laboratory 1: Sub-micron Semiconductor Process and Device Simulation
Laboratory 2: Integrated Circuits: Process, Device & Circuit Design

Elective Modules (Select 4)

Integrated Circuit Packaging
Failure Mechanisms in Semiconductor Devices
Silicon photonics
VLSI and ULSI Technologies
*Subject to addition/modification

Cross Discipline Modules

Business and Technical English
International Patent Law
Selected topics in Business and Administration
Selected topics in Management methods
Cultural, social and economical aspects of globalization
Aspects of European and Asian Culture and History

　
Modules Description

SUBJECT CONTENTS

Advanced Wafer Processing
Thin film deposition. Chemical and mechanical polishing. Lithography and resist technology. Etching process and technology. Cleaning technology. Process integration. Metrology and analytical techniques

Quality and Reliability Engineering
Quality management and planning. Statistical process control. Design of experiments. Reliability planning & statistical framework. Burn-in, FMEA and accelerated testing.

Advanced Topics in Semiconductor Devices
Bipolar transistor operating principles. Bipolar device modeling. State-of-the-art bipolar structures. MOS device operation. MOSFET modeling. MOS device scaling effects. Semiconductor memories. Semiconductor heterojunctions. Future trends and challenges.

Sub-micron Semiconductor Process and Device Simulation
The subject will cover the design and simulation for sub-micron integrated circuits and their fabrication. There will be virtual wafer fabrication, virtual device characterization and virtual process integration modules. The students will be required to carry out the design with hands-on project exercises through the use of simulation software packages.

Integrated Circuits: Process, Device & Circuit Design
Key design concepts pertaining to the fabrication and instrumentation of integrated silicon electronic circuits.

Failure Mechanisms in Semiconductor Devices
Introduction to Failure Mechanisms. Bulk failure mechanism of semiconductor devices. Dielectric failure mechanisms of semiconductor devices. Metallization failure mechanisms of semiconductor devices. Interface failure mechanisms of semiconductor devices. Reliability testing.

Integrated Circuit Packaging
Plastic packaging materials. Manufacturing processes for plastic encapsulated microelectronics. State-of-the-art packaging techniques. Failure mechanisms, sites and modes. Qualification process and accelerated testing. Effects of packaging on the electrical performance. Future trends and challenges.

Silicon Photonics
Silicon nanocrystal, silicon on insulator, light emitting diodes using silicon nanocrystal technology, lasers and modulators using silicon on insulator technology. Integrated Optoelectronics Circuits.

VLSI and ULSI Technologies
MOSFET and NMOS process technology. CMOS process technology. Bipolar process technology. MOSscaling rules and small geometry effects. CMOS isolation and latchup. MOS memory fabrication technology. Advanced VLSI and ULSI fabrication technologies.
　
Admission requirements
Good bachelor’s degree in electrical/electronic engineering or equivalent degree in other relevant disciplines as the Board of Graduate Studies may approve.

Preferably for those who have at least 6 months of relevant working experience.

Tuition fees
The tuition fee per semester for the ME (M.Sc.) programme is SGD 10,000

This fee is including:

·matriculation fees at relevant universities, teaching and examination fees
·lab materials and expenses
·expenses for intercultural program, including tickets for events and industry excursions
·all fees for scripts, excluding text books
·usage of all university facilities at TUM and NUS / NTU or relevant universities like??? library fees
·all administration fees
·fees for computer and internet access
·excursion and off-campus expenses for mandatory events
Fees charged do not depend on nationality. Our institute acts according to its non-discrimination policy.

Tuition fees are subject to change by action of the supervising boards.

Goods & Services Tax in Singapore (GST) is chargeable on the total tuition fee. It is waived only for international students sponsored by foreign companies.

The total tuition fee is payable to the German Institute of Science and Technology (GIST) in three equal instalment payments. The payment schedule is as follows:

1st payment is due in July upon confirmation or admission to the programme
2nd payment is due in January
3rd payment is due at the end of June

境内服务项目包括：
提供大学留学项目咨询；
提供大学面试前培训[包括：面试流程、问题类型、答题技巧等]；
负责个性化递申思路指导；
代办毕业证书公证、成绩单公证；
代办大学申请材料[大学申请表、留学意向书、个人简历等]；
代办高端专业申请文书的修改、润色、成型与翻译
代办大学语言、Foundation以及大学专业录取通知书；
协助办理因私护照；
代办境外医疗及以外伤害保险；
代办留学签证；
提供行前培训[日常学习、生活介绍]；
代购赴新加坡留学生机票；
国内集体送机。

境外服务项目包括：
提供境外专人机场接机服务；
提供电话供学生给家里报平安；
安排学生住进学生公寓，并协助学生签署租房协议；
协助学生办理入学注册手续；
代办学生证、学生学期车票；
代办新加坡境内医疗、以外伤害保险手续；
代办银行开户手续；
协助学生购买日常生活用品；
提供转学、转专业、转学分咨询；
代办留学签证续签、留学签证转工作签证；
协助解决在新加坡遇到的生活、学习问题。



新加坡留学网 - SIECC
Singapore International Education Consultation Center
权威专业的留学信息服务平台

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